Contract facts
Small business25-5A6 SBIR Phase Ii - Analysis and Re-Engineering of Printed Circuit Board Assemblies is a federal Small business award for Defense Microelectronics Activity held by Tda Research, Inc. Estimated value $1.3M ($1.3M obligated). Current period of performance ends Feb 2, 2027. Last award drew 5 bidders. Place of performance: GOLDEN CO.
25-5a6 sbir phase ii - analysis and re-engineering of printed circuit board assemblies. Latest action is a modification.
Recompete timing
PublicCurrent PoP ends Feb 2, 2027 (108 days remaining). Agencies typically plan 12–18 months ahead — at 3.5 months out, that window is already open. The buying decision is likely already in motion.
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Incumbent footprint
Public recordTda Research, Inc — $48.2M obligated across 102 awards (firm-wide, all agencies) · lead buyer Department of Defense (DOD).
Related awards
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Frequently asked questions
What is contract HQ072725CE002?
HQ072725CE002 (25-5a6 SBIR phase ii - analysis) is a Defense Microelectronics Activity award with a potential value of $1.3M, currently held by Tda Research, Inc. Figures are USASpending-sourced public-record facts plus SCOUT recompete analysis.
Which office awarded HQ072725CE002?
Defense Microelectronics Activity awarded HQ072725CE002 to Tda Research, Inc (potential $1.3M).
Who is the incumbent on HQ072725CE002?
Tda Research, Inc is the incumbent with $48.2M across 102 related awards in SCOUT’s public footprint. The current period of performance ends Feb 2, 2027.
When does Tda Research, Inc’s HQ072725CE002 come up for recompete?
SCOUT tracks a period-of-performance end of Feb 2, 2027. Actual solicitation timing can shift with extensions, bridges, or consolidations.
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